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Affiliation(s)

1. Department of Materials and Surface Engineering, Graduate School of Engineering, Kanto Gakuin University, 1162-2 Ogikubo, Odawara 250-0042, Japan
2. Materials and Surface Engineering Research Institute, Kanto Gakuin University, 1162-2 Ogikubo, Odawara 250-0042, Japan
3. Daeduck Electronics Co. Ltd., 335, Somanggongwon-ro, Siheung-si, Gyeonggi-do 15106, Korea

ABSTRACT

Recently, the minimization of the semiconductor packages is now being emphasized. WLP (Wafer Level Package) technology is emerging as an alternative to the FC-CSP and WB/FC-BGA technology using traditional PCB (Print Circuit Board), due to their technological limitations and increased cost. In FOWLP (Fan-Out Wafer Level Package), the chip is connected to the motherboard through composed of polymer and conducting layers, which replaces PCB. For the polymer layer, photosensitive dielectric material is being widely used for fine pattern traces and via hole smaller than 20 μm in diameter. To make fine pattern traces on photosensitive dielectric material considering the relationship between signal transmission and surface roughness, i.e. the skin effect, high adhesion strength and flatness surface is required. To satisfy such needs, sputtering technique with Ti-Cu or Ni-Cu is generally being used. In this study, UV treatment mechanisms to obtain a surface that is very flat and has high adhesion strength with the conducting layer were being studied without sputtering. Surface treatment with low pressure Hg lamp and Xe based excimer lamp was studied, as well as the relation to the adhesion strength between the surface and the conducting layer.

KEYWORDS

Photosensitive dielectric materials, UV irradiation, surface modification, plating, FOWLP.

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